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New color aberration confocal sensor 'CHRocodile MPS 2L'

No damage, deformation, or impact on shape to the sample! Compatible with hot end processes as well.

The "CHRocodile MPS2L" is a new color aberration confocal sensor (MPS) that can measure 24 points simultaneously. The wavelength difference corresponds to a constant thickness. It can handle multiple points with a single probe head. There is no damage, deformation, or impact on the shape of the sample. 【Features】 ■ Optical and non-contact ■ No consumables required ■ No damage, deformation, or impact on the shape of the sample ■ Capable of measuring inclined workpieces ■ Compatible with hot end processes *For more details, please refer to the PDF document or feel free to contact us.

Company：プレシテック・ジャパン
Price：Other

Optical Measuring Instruments
Sensors

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Vial Measurement Application Document

Ideal for automatic inspection of vial shape and thickness - High-speed, high-precision optical sensor.

This is an application document for vial measurement using a chromatic aberration confocal sensor. It features high speed and high precision, enabling the automation of thickness and shape inspection with PreciTech's optical sensors. There is a lineup of single-point, dual-point, and line sensors available. It offers Z resolution from a few nanometers and high-speed measurement up to 70 kHz. *For more details, please refer to the document. Feel free to contact us with any inquiries.*

Company：プレシテック・ジャパン
Price：1 million yen-5 million yen

Distance measuring device

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Chromatic Aberration Confocal Sensor 'CHRocodile C'

Accurate and stable measurements even at a maximum tilt of ±45°! Compatible with all surfaces.

"CHRocodile C" is a chromatic aberration confocal sensor that measures displacement or thickness due to chromatic aberration using white light. It has a compact size of under 440g. It is compatible with all surfaces, including "rough," "mirror," and "colored materials." The probe head is available in sizes from 200μm to 10mm. 【Features】 ■ Compact ■ Surface-independent ■ Accurate and stable measurements even at inclinations of up to ±45° ■ Shape-independent ■ Probe heads available from 200μm to 10mm *For more details, please refer to the PDF document or feel free to contact us.

Company：プレシテック・ジャパン
Price：Other

Optical Measuring Instruments
Sensors

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In-process measurement of wafer step height

The "CHRocodile 2 DPS color aberration confocal sensor" is equipped with two independent measurement channels.

In grinding operations, it is necessary to adjust the thickness of the wafer during processing. If using a non-contact, non-destructive optical measurement method, the thickness of the wafer can be monitored during processing without applying stress to the workpiece or damaging it, making it a suitable solution. Our "CHRocodile 2 DPS Chromatic Aberration Confocal Sensor" is equipped with two independent measurement channels. The sensor processes two chromatic aberration probes and synchronizes measurements and outputs in real-time, providing the final height and thickness of the wafer. 【Features】 ■ Development of chromatic aberration probes for harsh environments based on over 10 years of know-how in CMP and grinding interference measurement. ■ Non-contact measurement of wafer thickness in harsh environments. ■ Data acquisition rate of 10 kHz per probe. *For more details, please refer to the PDF document or feel free to contact us.

Company：プレシテック・ジャパン
Price：Other

Sensors

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Introduction of Presitech, a non-contact sensor manufacturer.

A non-contact sensor manufacturer skilled in measurements using color aberration confocal methods and spectral interference methods. Strong in high-speed and high-precision thickness and shape measurements. Capable of handling various materials!

Presitech is a non-contact sensor manufacturer based in Germany. It specializes in high-speed and high-precision thickness measurement and shape measurement, and is used for measuring and inspecting wafer thickness, edge shape, height, and flatness. It offers a wide measurement range, tolerance angles, and can accommodate various materials, with line sensors and area scanners suitable for full surface measurement. There are many proven applications in semiconductor manufacturing equipment, and it is also used in LCD manufacturing equipment and inline inspection of films. Additionally, it is utilized as a sensor for desktop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), during processing, film and coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, battery foil thickness, glass thickness, air gaps, etc. *For more details, please refer to the PDF document or feel free to contact us.*